Backing plates

Backing plates

Backing plate is one of the important components of the PVD sputtering process. OFHC Copper (Oxygen free, high conductivity) is the commonly used material. It exhibits the best electrical and thermal characteristics.

Aluminum, Molybdenum and Stainless Steel can also be used for backing plate fabrication when Copper is not appropriate. As an example, the desired sputtering target material may have a non-compatible coefficient of expansion compared to that of Copper which can cause the bonded target assembly to fail irrecoverably. In such case, the use of an alternative backing plate metal is essential.

Cleaning and packaging according UHV standards.

 

Manufacturing according your drawing: enter specifications of the backing plate in the table "Our customized products", then quantity, and click on +. You can send a drawing (pdf file) on the overview page of the quotation request.

Stock products

P/N Material Diameter Thickness Quantity
BPCU2PX3MM Copper CuC1 OFHC 2" 3 mm Add
BPCU3PX3MM Copper CuC1 OFHC 3" 3 mm Add
BPCU4PX3MM Copper CuC1 OFHC 4" 3 mm Add
BPCU82.5X3MM Copper CuC1 OFHC 82.5 mm 3 mm Add
BPCU107.5X3MM Copper CuC1 OFHC 107.5 mm 3 mm Add

Please, enter a numeric value

Our customized products

Material Diameter Thickness Quantity
Cu OFHC Add
Stainless Steel 304L Add
Al 99.9% Add
Mo 99.95% Add

Please, enter a numeric value

Can not find the desired product? Contact us

NEYCO
30 avenue de la Paix
92170 VANVES
Tel:+33(0)1 41 90 50 50
Fax:+33(0)1 41 90 50 51
e-mail: contact[@]neyco.fr