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Materials

Gold bonding wire, Au

fil d'or
fil d'or

Description

Neyco supplies bonding wires from TANAKA:

  • Au: Ø 15 +/-1 µm to 38 +/-1 µm
  • Au alloy: Ø 15 +/-1 µm to 30 +/-1 µm
  • Au Bumping wire: Ø 15 µm to 38 µm

All of our bonding wires are delivered with a specific certificate of analysis.

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Material type

Au, Au alloy, Fil de bumping Au

Diameter

Length/pool

Quantity
Material type Diameter Length/pool Quantity Add to cart

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Description

Neyco supplies bonding wires from TANAKA:

  • Au: Ø 15 +/-1 µm to 38 +/-1 µm
  • Au alloy: Ø 15 +/-1 µm to 30 +/-1 µm
  • Au Bumping wire: Ø 15 µm to 38 µm

All of our bonding wires are delivered with a specific certificate of analysis.


If you want an offer, or more information on this product, contact us:

+33 (0)1 41 90 50 50 Write to us

Fast delivery
in France and Europe

ISO 9001
and 14001 certifications

Service / Maintenance of
mechanical components