Mounting/Bonding

Neyco offers a complete target bonding service on new or existing backing plates, in our labaratory in Vanves:

• debonding or debrazing of your target
• backing plate cleaning
• new target bonding according the requested method
• cleaning and packaging of the assembly with UHV quality

Select your options in the followig table:

Free inquiry

Copper pads

Neyco has developed sputtering pads, CUPAD, as a replacement of Indium or Graphite foils or other bondings, for clamped targets.

• Cu metal properties for thermal transfer (from backing plate to target)
• Compensation of the mechanical stress of targets
• Electrical conductivity of Copper metal
• 99.95% purity
• Thickness of the pad after clamping 0.2 to 0.5 mm

In "Quantity": enter the requested length (e.g. 300 mm)

Graphite foil

For mounting of your target by clamping, Neyco offers Graphite foil, GPAD :

• thermal and electrical conductor
• Carbon purity > 99,9+ %, high density
• thickness of 0.2 mm

In "Quantity": enter the requested length ( e.g. 300 mm)

Silver epoxy

CERAC silver-filled epoxy cement is a silver-colored thick paste containing the optimum ratio of silver powder to epoxy resin for maximum thermal and electrical conductivity and mechanical strength. The catalyst is a clear to yellow liquid. Bonding is silver soft, withstands a temperature up to 150°C and is UHV compatible.
Both the epoxy cement and the catalyst should be stored in a refrigerator from 6 month to one year.