Neyco has developed sputtering pads, CUPADS and CUPADHD (HD for High Density), as a replacement of Indium or Graphite foils or other bondings for clamped targets.

The pad can be used in place of the Graphite or Indium foils, while providing higher thermal and electrical characteristics. Compressible up to 0.2 to 0.3 mm thick, the CUPADS and CUPADHD allows to catch up any mecanical deformations between the targets and the backing plates.

• Cu metal properties for thermal transfer (from backing plate to target)
• Compensation of the mechanical stress of targets
• Electrical conductivity of Copper metal
• 99.95% purity
• Thickness of the pad :

- before clamping 1.5 mm (CUPADS) or 2 mm (CUPADHD)

- after clamping 0.2 to 0.5 mm

In "Quantity": enter the requested length (e.g. 300 mm)